Interconnects Over 100 GHz [From the Guest Editors' Desk]

The three articles in this special section review modern developments in interconnects and packaging for frequencies above 100 GHz. In the last several years, useful systems operating at such frequencies have become feasible because of the cost reductions brought about by semiconductor device development, especially in silicon. But, for useable systems, there must also be advances in the packaging of such devices and in the means of coupling signals from the package to the transport medium. The medium of interest is free space for imaging or dielectric waveguides for interconnect.