Miniaturized device having two chips and process for its preparation

Electrical component (EB) comprising - a lower housing part (UG) with a concave portion (KA), - a lower chip (UC) to an electrical terminal (EA1), and a top chip (OC) to an electrical terminal (EA2), - an internal interconnection (IV) the electrical connections (EA1, EA2) of the lower (UC) and the upper (OC) chips, - an intermediate foil (ZF), wherein - the bottom chip (UC) is arranged in the concave portion (KA), - the intermediate film (IF) to the lower chip (UC) at least partially spans, - the top chip (OC) on the intermediate film (IF) is arranged above the lower die (UC), - the lower housing part (UG) has a sound entry opening (SEO) on the underside, has - in the intermediate film (IF) is arranged a sound passage opening (SDO), - the top chip (OC) is a MEMS chip microphone component structures, - the bottom chip (UC) is an ASIC chip, and - are the microphone component structures of the MEMS chip (OC) via the sound passage opening (SDO), and the sound inlet opening (SEO) with the surrounding atmosphere, the device in contact.