Thermal transport in nanostructured electronic materials: ET/ID: Enabling technologies and innovative devices

The relentless shrinking of microelectronic devices makes thermal management an increasingly important topic. To this end, we have developed a computational approach, which allows the prediction of heat flux in nanostructures based on atomistic simulations. As prototypical system, we present results for a silicon — silicon dioxide nanostructure, with (a) abrupt interfaces, and (b) interfaces after thermal annealing. A graphene sheet on amorphous SiO2 has been chosen as the second example to investigate the influence of a substrate on the extremely high thermal conductivity of this two-dimensional material.