A Resonant Micro-Pressure Sensor with Glass-on-Silicon Wafer Packaging

This paper presents a resonant micro-pressure sensor which was vacuum packaged by a glass-on-silicon wafer. The eigenfrequency shifts of two resonators induced under pressure measurements were susceptible to temperature disturbances. The glass-on-silicon wafer packaging can alleviate the side effect of temperature disturbances, and decrease eigenfrequency shifts of resonators. More specifically, the temperature sensitivities were quantified as 37.933 Hz/°C vs. 10.359 Hz/°C with corresponding eigenfrequency shifts measured as 10.2 Hz vs. 2.3 Hz, for the micro-pressure sensor with glass vs. glass-on-silicon packaging. Furthermore, under the pressure scale from 0.05 kPa to 10 kPa and temperature scale from -40 °C to 85 °C, the maximum measurement deviations were reduced from -11.72 Pa to -3.68 Pa with the help of the glass-on-silicon wafer packaging.