Preparation of molding

PURPOSE: To obtain a molding which has low dielectric loss, is excellent in heat resistance, water resistance, wear resistance and molding properties, and is useful as an insulating material and the like by heating a specific reactive resin mixture at a given temperature prior to its introduction into a mold, or the like. CONSTITUTION: The objective molding is obtained by heating a thermosetting reactive resin mixture comprising (A) one or more organic polyisocyanates, such as ethylene diisocyanate, (B) one or more organic compounds, such as bis-(N-epoxypropyl)aniline, having two or more epoxide groups, and (C) at least one of a tertiary or quaternary ammonium salt of an alkylating ester or acidic ester of an organic sulfonic acid or of phosphoric acid, which is a catalyst capable of being activated by heat, in such an amount that the equivalent ratio of isocyanate groups to epoxide groups may be 1.2/1-70/1, to a temperature upto 250°C prior to introduction of the mixture into a mold or during the mixture being molded in a mold. COPYRIGHT: (C)1995,JPO