Instrumented Modules for Mechanical Environment Characterization and Simulation Model Validation

A group of crystalline silicon glass-backsheet photovoltaic modules was designed and fabricated with strain gauges directly encapsulated within the module laminate. These instrumented modules were subjected to uniform mechanical pressure loading in stepped experiments, to correlate recorded internal strains against deformed module shapes. Strain data will also be used to validate computational finite element models of module deformation under load. This work serves as a proof-of-concept assessment of whether embedded strain gauge instrumentation can be used to accurately characterize internal module states during mechanical loading, and discusses lessons learned with the instrumentation, fabrication, and data acquisition process. Additional applications for the instrumented module concept could include deployment into field environments, to record module response to weather events and better define packaging robustness requirements, or measurement of internal strains over time to assess the impact of material viscoelasticity on internal components.