Method and apparatus for forming the stacked package

Disclosed herein are methods and apparatus for stacking packages or package (PoP) device. An IC package PoP device may include a connector or die and the decoupling capacitor electrical pathway, wherein the electrical path length may have a width within the range of from about 8μm to about 44μm and about 10μm to about 650μm range. Decoupling capacitor and the die may comprise the same package or in different packages PoP within the device, and the redistribution layer (RDL) and the connecting member are connected by the contact pads.