Semiconductor devices and methods of manufacturing of semiconductor devices

A device includes a semiconductor material having a first major surface, an opposing surface which is opposed to the first main surface and a side surface extending from the first major surface to the opposite surface. The device further includes a first electrical contact element which is arranged on the first main surface of the semiconductor material, and a glass material. The glass material includes a second major surface, wherein the glass material contacts the side surface of the semiconductor material and wherein the first major surface of the semiconductor material and the second major surface of the glass material are disposed in a common plane.