Low-shrinkage phenolic moulding compound

The invention discloses a low-shrinkage phenolic moulding compound, belonging to the technical field of thermosetting plastics. The low-shrinkage phenolic aldehyde moulding compound comprises the following raw materials in parts by weight: 20.0-35.0 parts of phenolic resin, 2.0-10.0 parts of thermosetting resin, 1.0-8.0 parts of curing agent, 0.2-2.0 parts of curing accelerator, 1.0-3.0 parts of lubricant, 30.0-50.0 parts of glass fiber, 1.0-10.0 parts of cotton fiber, 15.0-25.0 parts of nanoscale inorganic filler, 0.5-2.0 parts of coupling agent, and 0.5-4.0 parts of low shrinkage agent. In the technical scheme of the invention, the glass fibers and the cotton fibers are combined to improve mechanical strength, the strength and the shrinkage resistance of a material is improved completely by adopting the nanoscale inorganic filler and the adding the coupling agent and the low shrinkage agent, and the invention can meet the usage requirements of the industries of vehicles, electrical appliances, machineries and textiles on plastic products.