Three-dimensional molding device and method based on film substrate

The invention discloses a three-dimensional molding device and method based on a film substrate. The device comprises a feeding mechanism, an exposure mechanism, a supporting mechanism and a separating mechanism, wherein photosensitive material layers are sent to corresponding exposure areas through the feeding mechanism and then are exposed through the exposure mechanism so that solidification generation of each layer of specific pattern can be achieved, and the patterns on all layers are stacked to form a required part on the supporting mechanism; separation and exposure are conducted synchronously, a film substrate material layer is gradually separated from the top surface of the formed part on the supporting mechanism as the separating mechanism moves rightwards under the action of tension, and unexposed photosensitive material layers are stripped off to the space outside the supporting mechanism at the same time. By conducting exposure and separation synchronously, working efficiency can be improved, and requirements for large breadth, high efficiency, high precision and low cost during three-dimensional entity manufacturing are met.