Old Web
English
Sign In
Acemap
>
Paper
>
Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers
Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers
2014
Thomas Uhrmann
Jürgen Burggraf
Julian Bravin
Viorel Dragoi
Markus Wimplinger
Thorsten Matthias
Paul Lindner
Keywords:
Materials science
Electronic engineering
Composite material
Anodic bonding
Wafer backgrinding
Stacking
Wafer
wafer stacking
Correction
Source
Cite
Save
Machine Reading By IdeaReader
6
References
0
Citations
NaN
KQI
[]