Effect of lead concentration and electromigration on the kinetics of contact melting and phase formation in a Sn–(Bi + Pb) system

It is found that the kinetics of contact melting and the formation of contact layer structures depend on both the concentration of lead in the alloy and the direction of electric current during the process of contact melting. It is shown that direct current flowing through the zone of contact melting helps intensify this process and regulate the morphology of inclusions (their shapes, sizes, and direction of migration). The inversion of effective charge z Bi*, compared to two-component systems with Bi participation, is observed.