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A generic module for MEMS hermetic packaging at T~180 °C
A generic module for MEMS hermetic packaging at T~180 °C
2006
R. Hellin Rico
Jean-Pierre Celis
K. Baert
Chris Van Hoof
Ann Witvrouw
Keywords:
Electronic engineering
Microelectromechanical systems
Materials science
hermetic packaging
Mechanical engineering
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