Study on Anti-Adhesion Layers Using AFM for Nanoimprint Process

This study investigates how to improve the anti-adhesion issues between Silicon mold and nanostructures of hard polydimethylsiloxane (H-PDMS). A Silicon mold with different depths and widths was made using a focused ion beam (FIB). During the soft-lithography molding process, anti-adhesion layers were needed between the Silicon mold and H-PDMS samples to prevent the de-molding failure caused by the adhesion issues between the interfaces. This study adopts three methods to deposit anti-adhesion layers, such as liquid immersion, vapor deposition, and fluorine-doped diamond-like carbon (F-DLC) film. Perfluorooctyl-trichlorosilane (PFOTCS) was used as a mold-releasing agent for the liquid immersion and vapor deposition methods. The contact angles between each film were measured to determine the effect of anti-adhesion on the molding process. In addition, atomic force microscopy (AFM) was used to measure the adhesion force between the H-PDMS and anti-adhesion layers. The results show that the coatings of anti-adhesion layers are an effective approach to improve the formability of molding.