A Compact Millimeter-wave Frequency Conversion SOP (System on Package) Module Based on LTCC Technology

A novel compact millimeter-wave system on package (SOP) module is proposed in this paper. To achieve high integration, the 14 layers substrate of module is fabricated with low temperature co-fired ceramic (LTCC) technology, which is advanced in incorporating the passive components in multi-layers, thus realizing the signal vertical propagation for the SOP. The designed SOP covering 30∼40 GHz is the core module for the millimeter-wave radar system. When the transmitting state of the system is initiated, the introduced SOP will up mix input intermediate frequency (IF) signal with local signal (LO) to millimeter-wave band. And the received millimeter-wave signal will be down-converted to the IF signal during the receiving state. The SOP integrates two frequency conversion channels and 34 monolithic microwave integrated circuit (MMIC) chips, with final size of 35 mm × 48 mm. In the whole working band, transmitting signal has a power range of 10∼13 dBm with out-of-band spurious suppression below 50 dBc, while the channel under receiving has a gain of 11∼15 dB with automatic gain control (AGC) of 0∼50 dB and 1dB-step. The receiving and transmitting isolation between the two channels are both greater than 40 dB, and the T/R isolation in one channel is better than 40 dB.