A light emitting diode package and a manufacturing method

Disclosed herein are a light emitting diode package and a manufacturing method thereof. According to still exemplary embodiment of the present invention, there is provided a light emitting diode package, including: a housing; at least one light emitting diode chip configured to be disposed in the housing; a first phosphor configured to be excited by the at least one light emitting diode chip to emit green light; and a second phosphor configured to be excited by the at least one light emitting diode chip to emit red light, wherein white light is formed by a synthesis of light emitted from the light emitting diode chip, the first phosphor, and the second phosphor, the second phosphor is a phosphor having a chemical formula of A 2 MF 6 :Mn 4+ , the A is one of Li, Na, K, Rb, Ce, and NH 4 , and the M is one of Si, Ti, Nb, and Ta, and the Mn 4+ of the second phosphor has a range of the number of moles of 0.02 to 0.035 times about the M.