Socket and connection system

A socket for mounting an integrated circuit unit on a printed circuit board comprises a plurality of inserts of a platable electrically insulating material each having an opening and an exterior surface portion. The inserts are mounted in rows in a support body so the openings are accessible from one side of the body and the exterior surface portions are exposed at an opposite side of the body. Electrically conductive layers are provided on the inner surfaces of the insert openings, preferably by electroless plating techniques using the body as a plating mask, to extend to the exterior surface portions of the inserts to be soldered to circuit paths on the printed circuit board at prescribed circuit locations. Contacts are disposed in the insert openings in electrical engagement with the electrically conductive layers therein for resiliently and detachably electrically engaging terminals of integrated circuit units or the like inserted into the openings.