Technologies for manufacturing and recovering recoverable circuit board boring backing plate

The invention relates to a recycling technology field of a backing plate for processing a circuit board, and especially relates to technologies for manufacturing and recovering a recoverable circuit board boring backing plate. Mixed particles prepared by a high-molecular polymer, a vegetable fiber powder, an auxiliary agent and a foaming mother material, are manufactured to be a plate by a plastic plate production line, the plate is manufactured to be the backing plate by cutting and hot pressing through a hot press, the backing plate can be directly prepared to be recovery particles through cutting and particle cutting after boring the circuit board, the recovery particles and the foaming mother material are mixed to prepare the plate directly through the plastic plate production line, the plate can be prepared to be the backing plate by cutting and hot pressing through the hot press, and the cycle utilization may be repeated. Compared with the prior art, the technologies for manufacturing and recovering a recoverable circuit board boring backing plate not only reach technology requirement for the circuit board boring backing plate, but also implement the multi-time recovery utilization of the circuit board boring backing plate, reduce waste and pollution problems brought by a traditional backing plate, greatly save production cost, and protect environment.