Solder resist composition and covered printed wiring board

This solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator which contains a bisacylphosphine oxide photopolymerization initiator and an α-hydroxyalkylphenone photopolymerization initiator; and a fluorescent dye. The bisacylphosphine oxide photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The α-hydroxyalkylphenone photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propan-1-one. The mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propan-1-one is from 2:1 to 1:10.