Improving Solderability of BGA with Hydrogen Plasma

The solder balls of BGA are very easily oxidized.The appearance of BGA solder joints after reflow solder are unqualified,their electronic properties and thermal properties are very bad too.The deoxidation problem of BGA solder balls has not been solved.Introduce a good deoxidation method with hydrogen plasma reflow solder.This method organically combines hydrogen plasma and heating properly,it can effectively remove oxide layer of BGA solder balls.This method and process are simple,the result is noticeable,and the efficiency is high too.It is the best method to remove oxide layer of BGA and other surface mounting devices.