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A Novel Non-Destructive Approach to Deprocess the Sealing Cap from MEMS Device for Failure Analysis
A Novel Non-Destructive Approach to Deprocess the Sealing Cap from MEMS Device for Failure Analysis
2010
Hsien-Wen Liu
King-Ting Chiang
Tao-Chi Liu
Ming-Lun Chang
Jandel Lin
Keywords:
non destructive
Mechanical engineering
Microelectromechanical systems
Materials science
Correction
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