ALD-enabled hermetic sealing for polymer-based wafer level packaging of MEMS

Polymer-based packaging of micro electro mechanical systems (MEMS) can substantially reduce the processing temperature (≫300 °C), package size, and cost. In this paper, we demonstrated the feasibility of atomic layer deposition (ALD) enabled hermetic polymer packaging for MEMS applications using ALD on semi-polymer package and ALD on polymer package. We reported the hermeticity test results of ALD on semi-polymer package and a wafer-level packaging process developed for ALD on polymer package.