Evaluation of substrate noise coupling in RFICs (invited)

Substrate noise coupling and impacts on RF integrated circuits (RFICs) have been intensively studied for intending a single chip solution of wireless communication systems. On-chip measurements characterize noises from digital parts of mixed-signal ICs in terms of noise generation as well as noise propagation through a silicon substrate, demonstrated by silicon results with sub-100 nm CMOS test vehicles. Simulation and emulation help further understanding of the interference of such noises with RFIC operation as well as their impacts on RF communication.