New automated prober support for high pincount test heads

Automatic best-fit tip-to-pad alignment and skewed chip probing based on high-speed image processing is described. A complete solution is presented to automate and optimize the probe set up. It can be implemented as operator assist or as total automation, depending on the status of the local system. It is concluded that high-speed image processing techniques should also be able to keep pace with the near future's demands, such as automatic docking of test heads. >