Glass, plastic, and semiconductors: packaging techniques for miniature optoelectronic components

At Lawrence Livermore National Laboratory, we have extensive experience with the design and development of miniature photonic systems which require novel packaging schemes. Over the years we have developed silicon micro-optical benches to serve as a stable platform for precision mounting of optical and electronic components. We have developed glass ball lenses that can be fabricated in-situ on the microbench substrate. We have modified commercially available molded plastic fiber ribbon connectors (MT) and added thin film multilayer semiconductor coatings to create potentially low-cost wavelength combiners and wavelength selective filters. We have fabricated both vertical-cavity and in-plane semiconductor lasers and amplifiers, and have packaged these and other components into several miniature photonics systems. For example, we have combined the silicon optical bench with standard electronic packaging techniques and our custom-made wavelength-selective filters to develop a four-wavelength wavelength-division-multiplexing transmitter module mounted in a standard 120-pin ceramic PGA package that couples light from several vertical-cavity-surface-emitting-laser arrays into one multimode fiber-ribbon array. The coupling loss can be as low as 2 dB, and the transmitters can be operated at over 1.25 GHz. While these systems were not designed for biomedical or environmental applications, the concepts and techniques are general and widely applicable.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.