A process for the lamination with use of special polyurethane adhesives
2003
A process for bonding sheet-like, flexible substrates with non-flexible substrates (short for laminating substrates), characterized in that the adhesive used for bonding 0.0001 to 0.1 mol of carbodiimide groups per 100 g of adhesive (water or other organic solvents having a boiling point below 150 ° C at 1 bar is not included in the calculation) which contains adhesive is applied to the flexible substrate and the adhesive coated flexible substrate with the non-flexible substrate is bonded.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI