A process for the lamination with use of special polyurethane adhesives

2003 
A process for bonding sheet-like, flexible substrates with non-flexible substrates (short for laminating substrates), characterized in that the adhesive used for bonding 0.0001 to 0.1 mol of carbodiimide groups per 100 g of adhesive (water or other organic solvents having a boiling point below 150 ° C at 1 bar is not included in the calculation) which contains adhesive is applied to the flexible substrate and the adhesive coated flexible substrate with the non-flexible substrate is bonded.
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