Multilayered product, process for producing the same, and process for minimizing formation of metallic particle

PURPOSE: To enhance the mutual adhesion of polyimide layers and the adhesion of polyimide and a metal substrate in a multilayered product in electronic mounting. CONSTITUTION: A multilayered product 10 contains terminal unsaturated adhesive polyimide 16 bonded to itself and the surface of the adhesive polyimide opposite to a substrate is bonded to polyimide 18. Further, one set or plural sets of the alternate layers of terminal unsaturated adhesive polyimide 16 and polyimide are provided. Novel adhesive polyimide is adhesive polyimide such as ODPA-APB having a terminal unsaturated heterocyclic group such as azaadenine, aminobenzotriazole, aminopurine or aminopyrazolopyrimidine.