Integration of high-performance RF passive modules (MIM capacitors and inductors) in advanced BEOL

Passive components are key elements for the integration of system-on-chips, fixing circuit performance and down-scaling capability. The integration of MIM capacitors and inductors among Cu BEOL of CMOS technologies faces many challenges and requires technological innovations in the field of material, process, and architecture developments. An overview of the main challenges and investigated solutions is presented in this paper.