Electron beam writing of continuous resist profiles for optical applications

This article reports on progress in the fabrication by e‐beam lithography of high resolution, continuous‐relief microstructures for integrated optical applications in the visible and near infrared. The microstructures are designed for subsequent replications from an electroformed metal shim by embossing into polymer films on glass. The objective of this work is to fabricate complete integrated optical devices and circuits by low‐cost embossing or casting replication technology.