A new simple and reliable method to form a textured Si surface for the fabrication of a tunnel oxide film

In this work, a textured Si surface was formed with a new simple and reliable method for tunnel oxide fabrication. First, a thin poly-Si layer (12 nm thick) was deposited on Si surface and a 30-nm thick dry oxide film was then grown in O/sub 2/ ambient. This oxide film was served as a sacrificial oxide. The poly-Si film and Si substrate were both oxidized during thermal oxidization. After stripping this sacrificial oxide, a textured Si surface was obtained. Tunnel oxide grown on this textured Si surface has asymmetrical J-E characteristics, less interface states generation and better reliability (larger Q/sub bd/) as compared to those of normal oxide.