Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D

The processing conditions for photosensitive BCB (Cyclotene** 4024-40 and Cyclotene** 4026-46) were defined for a thin film Cu/Photo-BCB MCM-D structure. Fabrication of four layer MCM-Ds, designed by Sandia National Laboratories, was demonstrated. The modules were electrically tested, solder bumped, flip chip assembled and put through a reliability test program.