Vertical-type wafer shape measuring instrument

A vertical-type wafer shape measuring instrument comprises adjusting pad feet, a base, a platform, support seats, a cross beam, an axis system, a wafer bearing table and a contact-type measuring head, wherein the base is arranged on the adjusting pad feet; the platform is arranged on the base; the support seats are arranged on the platform; the cross beam is arranged on the support seats; the axis system comprises an X axis, a Y axis, a Z axis and a rotating axis; the X axis is arranged on the cross beam; the Y axis is arranged on the platform and perpendicular to the X axis; the Z axis is fixed on a movable X axis plate and perpendicular to the moving direction of the X axis; the moving direction of the Z axis is perpendicular to the measuring platform; the rotating axis is fixed on a movable Y axis plate; the wafer bearing table is fixed on the rotating axis; the contact-type measuring head is fixed on a movable Z axis plate. According to the vertical-type wafer shape measuring instrument, the unique contact-type measuring head, fixed-cross beam-type arrangement, the straight axes and the rotation axis are adopted, so that automatic measurement to the shape parameters of wafers, such as the flatness and thickness, are realized, wherein the straight axes and the rotation axis are controlled precise servos.