A method for manufacturing a wiring board

PROBLEM TO BE SOLVED: To provide a method for improving adhesion between metal and resin in a wiring board such as a semiconductor package board manufactured by a method for previously disposing outer connection terminals in a metallic sheet and filling the outer connection terminals with resin being a base material. SOLUTION: The wiring board is provided with a resin layer, a circuit on at least one face of the resin layer, and a plurality of columnar outer connection terminals protruded into the resin layer to an opposite face of the resin layer from the circuit. Surfaces where the circuit and the outer connection terminals are brought into contact with resin in the resin layer are made rough. A semiconductor package is provided with the wiring board, a semiconductor chip loaded on the wiring board and a sealing material sealing a semiconductor chip loading face in the wiring board. COPYRIGHT: (C)2004,JPO