A semiconductor device, silicon wafers and methods for making a silicon wafer

A method for making a silicon wafer includes a drawing of an n-type silicon ingot through a drawing period of time from a silicon melt comprising n-type dopants (S100). The method further comprises a Attaching p-type dopants to the silicon melt over at least part of the drawing time period, to thereby an n-type dopant in the n-type silicon ingot to compensate for from 20% to 80% (S110) , The method further comprises slicing the silicon ingot (S120).