Effect of Complex Agent on Characteristics of Copper Conductive Pattern Formed by Ink-jet Printing

In this study, Cu ion complex ink was successfully synthesized by a modified electrolysis method in which the Cu ions generated from bulk metal plates by an electric field were coordinated with complex agents. The synthesized ink was ink-jet-printed on a flexible substrate and converted to a dense Cu pattern after sintering at 250 °C. The pattern was characterized by X-ray diffractometry, field emission scanning electron microscope, and four-point probe method to confirm the crystal structure, microstructure, and electrical conductivity, respectively. The effect of the type of complex agent on the characteristics of a Cu conductive pattern was also determined using the analysis results. Finally, we conducted the direct writing of conductive dots and lines using the Cu ion complex ink, and confirmed that fine patterning for application in electronics is possible with the Cu ion complex ink.