A Comparative Electro-Mechanical Characterization of Tin-Lead Solder with Equal Proportion

Mechanical and electrical conduction characteristics of the commonly used Sn50Pb50 solder are investigated in comparison with those of constituting pure metals. For mechanical characterization, microhardness, tensile strength, elongation, impact energy as well as photo micrographs to study the microstructure of the three material samples are analyzed. The frequency response of the material samples is investigated in terms of electrical impedance, dielectric constant as well as dielectric loss. The standard I-V characteristics is also studied to compare the DC electrical conductivity of the solder sample in comparison with the base metals. It is found that the introduction of lead to tin causes an improvement in its strength, hardness while causing a reduction in ductility and toughness. Addition of lead also improves upon the dielectric and impedance characteristics of the alloy. Increased grain boundary and grater orientational misalignment between the grains also cause a reduction in DC conductivity in Sn50Pb50 alloy.