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Low Cost Flip Chip Technologies Based on Chemical Nickel Bumping and Solder Printing
Low Cost Flip Chip Technologies Based on Chemical Nickel Bumping and Solder Printing
1996
Joachim Kloeser
Jörg Gwiasda
Elke Zakel
Andreas Ostmann
Herbert Reichl
Franz Bechtold
Keywords:
Soldering
Bumping
Flip chip
Nickel
Nanotechnology
Materials science
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