Multiphysics Analysis of Hemi-Spherical Bulk Conductor Hertzian Contact Under Uniaxial Mechanical Load

A multiphysics model of smoothed contact surface hemispherical contact under dynamic vibration stress is treated in this paper. The contact structure is applied to hemispherical conductor bulk materials. The structure electrothermomechanical (ETM) behavior is investigated based on the Hertz contact theory coupled with electrokinetic approach. An electrical circuit integrating the contact material properties is proposed. The contact surface deformation ETM expression is formulated. The transient variations of the contact conductor material temperatures in function of the mechanical vibrations are analytically described. The ETM parameters range versus the mechanical load stress is analyzed by considering aluminum alloy material hemispherical bulk with a radius varying from 10 μ m to 1 mm. The contact radius can be totally deformed when the load is increased up to 20 kN. In addition, an innovative multiphysics computational method is validated numerically to determine the transient variation of the contact surface radius model from SPICE simulation by considering 0.5 kHz/1 kHz frequency presenting 0.5-kN amplitude sine wave, and arbitrary waveform dynamic vibrations. It was conjectured from numerical application, the hemispherical bulk contact temperature, and also the mechanism multiphysics phenomena governing the structure behavior. As ongoing research, the equivalent system tensorial statement illustrating the multiphysics interaction between the conductor contacts will be developed.