A Numerical Study of Solder Paste Rolling Process for PCB Printing

This work is supported by: European Structural and Investment Funds in the FEDER component, through the Operational Competitiveness and Internationalization Programme (COMPETE 2020) [Project no 002814; Funding Reference: POCI-01-0247-FEDER-002814]. This work was financed by FCT, under the Strategic Project UID/SEM/04077/2013. Additionally, by COMPETE: POCI-01-0145-FEDER-007043 and FCT within the Project Scope: UID/CEC/00319/2013.