Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics

Abstract When using nanopaste as bonding material, residual organics are inevitable in the sintered bondline and normally considered as having negative effects. This paper firstly finds that proper residual organics can stabilize the bondline microstructure which is very important for high temperature electronics. The results show that nanopores in the sintered bondline tend to coalesce during high temperature service and the pore size growing rate is much faster if no residual organics in the bondline. However, about 2.2 wt% residual organics can largely suppress the growing rate and almost cease the nanopore growing at 350 °C for 800 h. It is mainly because that the naturally uniformly distributed residual organics inhibit the nanopore surface diffusion.