Submicron, unbacked, shaped metal foils
1983
A method was developed to produce unbacked, shaped metal foils in sub-micron thicknesses. This process utilizes a temporary substrate consisting of a water-soluble polymer film as a base for the electron-beam deposition of the metal layer. After formation of the metal foil, the polymer is removed by immersion of the assembly in water. Unbacked metal-foil cylinders as thin as 0.17 ..mu..m with extremely smooth, wrinkle-free surfaces have been produced by this technique. Polyvinyl alcohol was an excellent substrate. Aluminum foils were produced.
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