Inter-Chip Data Transfer Capability of TSV-Free Interposer (TFI) Package

TSV-Free Interposer (TFI) has been proposed as a cost-effective package solution alternative to conventional 2.5D package for high-end computing applications. In this study, signal integrity of TFI package is evaluated by both simulation and RF measurements. Well matched RF performance is obtained for both measured and simulated results by using RF test structure fabricated in TFI package. This supports that the TFI interconnects with 6 mm length which is required to connect CPU/GPU and HBM are capable of the data rate of 2 Gbps.