A new encapsulating method for semiconductor devices using resin sheets

This paper describes a new encapsulating method using resin sheets. In this method, uncured resin sheets are placed on both sides of semiconductor chip, and inserted into heated molds. The resin sheets placed on the chip are fused and fill up the mold cavity. Then the resin is cured. This method is very suitable for fabricating packages which are as thin as 0.3 mm. Such thin model packages achieved high reliability under pressure cooker test and thermal cycle test.