Halogen and phosphor-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby

The invention relates to a halogen-free non-phosphate fire-retardant epoxy resin composition and a bonding sheet and a copper-clad laminate which are manufactured by the same. The resin composition consists of compositions and a solvent, wherein the compositions comprise biphenyl epoxy resin, a composite curing agent and filler; and the composite curing agent consists of benzoxazine resin, azotic phenol-formaldehyde resin and diaminodiphenylsulfone. The copper-clad laminate which is manufactured by the resin composition comprises a laminate and metal foils which are covered on one side or both sides of the laminate, wherein the laminate comprises a plurality of adhered bonding sheets which are manufactured by the halogen-free non-phosphate fire-retardant epoxy resin composition. The resin composition does not contain halogen and phosphor element, and the fire resistance reaches UL94V-0 level; and the bonding sheet and the copper-clad laminate which are manufactured by the resin composition have high heat resistance, high reliability, high glass-transition temperature, flame retardancy, low water absorption rate, low dielectric loss, low thermal expansion coefficient and good processability.