Hardware technology for Hitachi M-880 processor group

The authors explain the high-speed high-density semiconductor technology and high-density installation technology developed for the super-high-speed high-reliability M-880 processor groups. To achieve the design goals, a set of advanced hardware technologies has been developed in such areas as semiconductor, ceramic module board, printed circuit board, electric part, cooling, and power feeding. The innovative hardware technologies have been brought into realization by the development of advanced manufacturing techniques and process techniques in addition to the conventional design automation techniques, inspection and diagnosis techniques, and reliability evaluation techniques. During the design, high-precision high-efficiency design evaluations were carried out using software simulation technologies including a three-dimensional electrical characteristic analyzing program a circuit analyzing program, and a thermal stress analyzing program. >