Soft plate electroplating solution with high TP (throwing power) value and electroplating method

The invention provides a soft plate electroplating solution with a high TP (throwing power) value and an electroplating method. The soft plate electroplating solution with the high TP value comprises components A-E, wherein the component A is anhydrous copper sulfate, the component B is sulfuric acid, the component C is chloride, the component D is one or a mixture of at least two of sodium 3,3'-dithiodipropane sulfonate, 3-sulfydryl sodium propanesulfonate, N, N-dimethyl dithiocarboxylic sodium propanesulfonate, isothioureapropanesulfonate and 3-(benzothiazole-2-sulfydryl) sodium propanesulfonate, and the component E is one or a mixture of two of polyethylene glycol, polypropyl-alcohol and fatty amine polyoxyethylene ether. The soft plate electroplating solution with the high TP value is low in total organic carbon content, electroplated copper is high in ductility and thermal impact reliability resistance, the through hole TP value of a soft plate is high; and meanwhile, the soft plate electroplating solution can use high current density, and can be widely used for fine through hole copper plating of the soft plate.