Inline defect control for automotive memory devices in IC manufacturing

Zero-defects is the target for automotive devices in semiconductor manufacturing fabs. The challenges created by 100% inline inspection wafer sampling and new lithography processes have resulted in a critical need for wafer inspection. We have several requirements for the inspection tools: high capture rate with very low nuisance defect rate, high throughput with high sensitivity, and efficient high-quality defect review images to increase productivity. This paper is based on several months of photolithography wafers inspection data results. Our goal with this investigation was to meet the high volume and high reliability requirement.