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Advancements in bumping technologies for flip chip and WLCSP packaging
Advancements in bumping technologies for flip chip and WLCSP packaging
2009
Manessis
Patzelt
Ostmann
Reichl
Keywords:
Resist
Nanotechnology
Photolithography
Wafer-level packaging
Flip chip
Solder paste
Bumping
Stencil printing
Chip-scale package
Materials science
Correction
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