Electronic packing piece and package substrate

The utility model discloses an electronic packing piece and package substrate. Package substrate includes a line structure and an insulating pattern. Line structure includes an at least connection gasket and one installs the pad, wherein install to fill up to be used for supplying an electronic component to install, and the connection gasket is used for electric connection electronic component. Insulating pattern interconnecting link structure. Above -mentioned electronic packing piece includes package substrate and cover electronic component's mould seal.