Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V)

The performance and reliability of a low-cost three-dimensional plastic moulded vertical multi-chip module concept is presented. Performance was evaluated using custom designed chips incorporating thermal, thermomechanical, electrical and reliability test structures. Results of performance are presented and are shown to correlate well with thermal, thermomechanical and electrical simulations. The thermal and thermomechanical performances are sufficient to allow use of the MCM-V technique in a wide range of applications without the need for special cooling techniques. Reliability testing to space level standards was carried out on 53 technology demonstrator modules incorporating the test chips and a high level of reliability has been demonstrated.